New control software has been released for the Dataman 48Pro2C, 48Pro2, 48Pro2AP, 448Pro2, 448Pro2AP, 848Pro2, MEMPro, 40Pro and 448Pro2AP-AU programmers.
Version 4.11 features the following amendments:
New Device Support
Analog Devices: LTC2980AY-24, LTC2980-24, LTC3886, LTC3889, LTC4281, LTC7880
Etron Technology: EM73E044VCK-H [LGA8], EM73F044VCE-H [LGA8], EM78C044VCG-H [LGA8], EM78D044VCG-H [LGA8], EM78E044VCE-H [LGA8], EM78F044VCC-H [LGA8]
Giantec Semicond.: GT25Q32YB-L [SOP8-150] (QuadSPI), GT25Q32YB-L [SOP8-150], GT25Q32YB-L [SOP8-208] (QuadSPI), GT25Q32YB-L [SOP8-208], GT25Q32YB-L [WSON8 5x6] (QuadSPI), GT25Q32YB-L [WSON8 5x6], GT25Q32YB-L [USON8 4x3] (QuadSPI), GT25Q32YB-L [USON8 4x3], GT25Q32YB-L [USON8 2x3] (QuadSPI), GT25Q32YB-L [USON8 2x3], GT25Q16YB-L [SOP8-150] (QuadSPI), GT25Q16YB-L [SOP8-150], GT25Q16YB-L [SOP8-208] (QuadSPI), GT25Q16YB-L [SOP8-208], GT25Q16YB-L [TSSOP8] (QuadSPI), GT25Q16YB-L [TSSOP8], GT25Q16YB-L [WSON8 5x6] (QuadSPI), GT25Q16YB-L [WSON8 5x6], GT25Q16YB-L [WSON8 6x8] (QuadSPI), GT25Q16YB-L [WSON8 6x8], GT25Q16YB-L [USON8 4x3] (QuadSPI), GT25Q16YB-L [USON8 4x3], GT25Q16YB-L [USON8 2x3] (QuadSPI), GT25Q16YB-L [USON8 2x3]
GigaDevice: GD25D10C [SOP8-208], GD25D10C [USON8 3x2], GD25LQ16E [USON8 3x2] (QuadSPI), GD25LQ16E [USON8 3x2], GD25LQ16E [USON8 3x4] (QuadSPI), GD25LQ16E [USON8 3x4], GD25LQ16E [WSON8 6x5] (QuadSPI), GD25LQ16E [WSON8 6x5], GD25WQ64E [SOP8-208] (QuadSPI), GD25WQ64E [SOP8-208], GD25WQ64E [USON8 4x4] (QuadSPI), GD25WQ64E [USON8 4x4], GD25WQ64E [WSON8 6x5] (QuadSPI), GD25WQ64E [WSON8 6x5], GD25WQ64E [USON8 3x4] (QuadSPI), GD25WQ64E [USON8 3x4]
Hua Hong ZealCore: BH25FQ64ES (QuadSPI), BH25FQ16ES [USON8 4x3] (QuadSPI), BH25FQ16ES [SOP8-208] (QuadSPI), BH25FQ16ES [SOP8-150] (QuadSPI), BH25FQ16ES [WSON8 5x6] (QuadSPI), BH25FQ16ES [WSON8 6x8] (Quad I/O), BH25FQ16ES [USON8 4x4] (QuadSPI), BH25FQ16ESU [USON8 2x3] (QuadSPI), BH25FQ16ES [USON8 4x3] (QuadSPI), BH25FQ16ES [TSSOP8] (QuadSPI), BH25FQ128ES (QuadSPI), BH25FQ64ES, BH25FQ16ES [SOP8-208], BH25FQ16ES [SOP8-150], BH25FQ16ES [WSON8 5x6], BH25FQ16ES [WSON8 6x8], BH25FQ16ES [USON8 4x4], BH25FQ16ESU [USON8 2x3], BH25FQ16ES [USON8 4x3], BH25FQ16ES [TSSOP8], BH25FQ128ES
JingZhong Semi: WILX2000HC [csBGA132], WILX2000HC [csBGA132](SVF), WILX2000HC [csBGA132](VME)
Kingston Techn.: EMMC16G-IB29-PZ90 [FBGA153], EMMC32G-IB29-PZ90 [FBGA153], EMMC64G-IB29-PZ90 [FBGA153]
Linear Technology: LTC2980AY-24, LTC2980-24, LTC3886, LTC3889, LTC4281, LTC7880, LTM4676
Macronix: MX35UF2GE4AC-Z4J [WSON8], MX77U25655G [SOP16] (Quad I/O), MX77U25655G [WSON8 6x5] (Quad I/O), MX77U51255G [SOP16] (Quad I/O)
Microchip: dsPIC33AK256MC205, dsPIC33AK256MC206, dsPIC33AK256MC505, dsPIC33AK256MPS205, dsPIC33AK256MPS206, dsPIC33AK256MPS505, dsPIC33AK256MPS506, dsPIC33AK256MPS508, dsPIC33AK256MPS510, dsPIC33AK512MPS205, dsPIC33AK512MPS206, dsPIC33AK512MPS208, dsPIC33AK512MPS210, dsPIC33AK512MPS212, dsPIC33AK512MPS505, dsPIC33AK512MPS506, dsPIC33AK512MPS510, dsPIC33AK512MPS512, PIC32MZ1025DAA169, PIC32MZ1025DAK169, PIC32MZ1064DAA169, PIC32MZ1064DAK169, PIC32MZ2025DAA169, PIC32MZ2025DAK169, PIC32MZ2025DAL169, PIC32CM2532LE00100 [TQFP100], PIC32CM5164LE00100 [TQFP100], PIC32CM5164LE00048 [VQFN48], PIC32CM2532LE00048 [VQFN48], PIC32CM2532LE00064, PIC32CM5164LE00064
Micron: MT25QU128ABA8E [XFWLBGA15] (Quad I/O)
ON Semiconductor: FAN251015, FAN251030, FAN251040
Puya Semiconductor: PY25Q256HB [WSON8 8x6] (Quad I/O), PY25Q128HA [SOP8-150] (Quad I/O), PY25Q128HA [WSON8 8x6] (Quad I/O), PY25Q128HA [USON8 4x4] (Quad I/O), PY25Q128HA [SOP16] (Quad I/O), PY25Q128HA [TFBGA24] (Quad I/O), PY25Q128HA [SOP8-150], PY25Q128HA [WSON8 8x6], PY25Q128HA [USON8 4x4], PY25Q128HA [SOP16], PY25Q128HA [TFBGA24]
Renesas: R5F12008xNS
SanDisk: SDINBDA6-32G-xA [FBGA153]
STMicroelectronics: SPSA068 [QFN32], STM32G031C4T [LQFP48], STM32G031C6T [LQFP48], STM32G031C8T [LQFP48], STM32G031C4U [UFQFPN48], STM32G031C6U [UFQFPN48], STM32G031C8U [UFQFPN48], STM32G031C4 (ISP-SWD), STM32G031C6 (ISP-SWD), STM32G031C8 (ISP-SWD), STM32G081CBT [LQFP48], STM32G0C1CET [LQFP48], STM32U585QIIxQ [UFBGA132], STM32L552CCT [LQFP48], STM32L552CCU [UFQFPN48], STM32L552CC (ISP-SWD), STM32L552CET [LQFP48], STM32L562CET [LQFP48], STM32L562CEU [UFQFPN48], STM32L562CE (ISP-SWD), STM32C562RET [LQFP64], STM32C562RE (ISP-SWD), STM32C531RCT [LQFP64], STM32C532RCT [LQFP64], STM32C542RCT [LQFP64], STM32C551RET [LQFP64], STM32C552RET [LQFP64], STM32C531RC (ISP-SWD), STM32C532RC (ISP-SWD), STM32C542RC (ISP-SWD), STM32C551RE (ISP-SWD), STM32C552RE (ISP-SWD)
TI (TMS): TPS544B27W, PTPS544C27, TPS6521908, TPS652190C, TPS6521940, TPS6521505, TPS65220053
UNIM: UM19C0HISW [WSON8] (64B spare)
Winbond: W25Q128JWxxM [WLCSP21] (QuadSPI), W25Q128JWxxM [WLCSP21], W25Q128JWxxM-DTR [WLCSP21] (QuadSPI), W25Q128JWxxM-DTR [WLCSP21], W25Q80RLxxxQ, W77Q128JWxxR [SOIC8-208] (QuadSPI), W77Q128JWxxR [WSON8 6x5] (QuadSPI), W77Q128JWxxR [SOIC8-208], W77Q128JWxxR [WSON8 6x5]
XMC: XM25QH32CJxGxxxQ [SOP8-150] (QuadSPI), XM25QH32CJxGxxxQ [SOP8-150]
Other Changes
Added adapter: BGA-Top-237a ZIF
Added adapter: DIL24W/TSSOP24-2 ZIF 170mil
Added adapter: DIL48/BGA210-1 ZIF LT-1
Added adapter: DIL48/QFN32-1.02 ZIF PMIC-3
Added adapter: DIL48/QFP80-1.02 ZIF NEC-8
Added adapter: DIL48/WQFN33-1 ZIF TPS544-1
Added adapter: DIL8/BGA15-1 ZIF SFlash-1b
Added module: AP1 QFN32-1.02 ZIF CY-1
Added module: AP1 QFN32-1.02 ZIF TPS-1
Added module: AP1 QFN52-1.02 ZIF MP-3
AP1 BGA144-4.01 ZIF STM32-4, interface modified
BGA-Bottom-561, interface modified
Etron Technology EM73E044VCE-H [LGA8], CASN support added
Microchip AVRxmega series (ISP-PDI), Added missing connection details in device info
Microchip PIC18FxxK22 Family, power-on procedure improved
STMicroelectronics STM32C562 [LQFP64], option bytes erase algorithm modified
STMicroelectronics STM32C562 [LQFP64], direct settings, missing WRP protection register added
STMicroelectronics STM32L5 devices, inZIF communication speed increased
STMicroelectronics STM32L5xxQxI [UFBGA132] devices, algorithm modified
STMicroelectronics STM32U5xxQxI [UFBGA132] devices, algorithm modified
Texas Instruments MSPM0Cxxx, power-up sequence improved
TI (TMS) MSP430FR2353, programming procedure modified
Toshiba TXZ3/TXZ3+ series, messages in Programmer activity log for blank check after erase operation improved
Winbond W25Q256JVxxQ, Alt+S menu improved
XMC XM25QH32CHxGxxxQ [SOP8-208], changed device name and backward project compatibility
Bug Fixes
Macronix MX35UF2GE4AC [WSON8], partname changed to MX35UF2GE4AC-Z4I [WSON8] and spare area ECC layout fixed
Microchip (SST) SST25WF010 [SOIC8], ID check and size of memory area fixed
Winbond W25R256JVxxQ, verification procedure for Status Registers bug fixed
Please Note
Changes, new device support and bug fixes are model specific and do not apply to all programmers.