New control software has been released for the Dataman 48Pro2C, 48Pro2, 48Pro2AP, 448Pro2, 448Pro2AP, 848Pro2, MEMPro, 40Pro and 448Pro2AP-AU programmers.
Version 4.02 features the following amendments:
Major Changes
File saving improvements for JEDEC/POF file formats
Load file to secondary buffer from cmd line and Remote control of PG4UW
Save project file from Remote control of PG4UW
New Device Support
Adesto Techn.: AT25DF256 [TSSOP8] (Dual I/O), AT25EU0161A (Quad I/O)
Atmel: AT89C55 [PQFP44], ATSAME70Q21A [UFBGA144], ATSAME70Q21B [UFBGA144], ATSAME70Q19A [UFBGA144], ATSAME70Q19B [UFBGA144], ATSAME70Q20B [UFBGA144], ATSAME70Q20A [UFBGA144], ATSAMS70Q19B [UFBGA144], ATSAMS70Q19A [UFBGA144], ATSAMS70Q20B [UFBGA144], ATSAMS70Q20A [UFBGA144], ATSAMS70Q21B [UFBGA144], ATSAMS70Q21A [UFBGA144]
Azoteq: IQS228D
cFeon(Eon Si.Sol.): EN25QX64A(2D) [SOP8-208] (QuadSPI), EN25QX64A(2D) [SOP8-150] (QuadSPI), EN25QX64A(2D) [USON8 4x4] (QuadSPI), EN25QX64A(2D) [WSON8 8x6] (QuadSPI), EN25QX64A(2D) [WSON8 6x5] (QuadSPI), EN25QX64A(2D) [SOP8-208], EN25QX64A(2D) [SOP8-150], EN25QX64A(2D) [USON8 4x4], EN25QX64A(2D) [WSON8 8x6], EN25QX64A(2D) [WSON8 6x5], EN25QX256A(2UC) [SOP8-208] (QuadSPI), EN25QX256A(2UC) [WSON8 8x6] (QuadSPI), EN25QX256A(2UC) [WSON8 6x5] (QuadSPI), EN25QX256A(2UC) [SOP8-208], EN25QX256A(2UC) [WSON8 8x6], EN25QX256A(2UC) [WSON8 6x5]
Cypress: S28HS02GTFPBxx05 [BGA24] (Octal I/O)
Dallas: DS2406 [TO-92], DS2406 [TSOC6]
Eon Silicon Sol.: EN25QX64A(2D) [SOP8-208] (QuadSPI), EN25QX64A(2D) [SOP8-150] (QuadSPI), EN25QX64A(2D) [USON8 4x4] (QuadSPI), EN25QX64A(2D) [WSON8 8x6] (QuadSPI), EN25QX64A(2D) [WSON8 6x5] (QuadSPI), EN25QX64A(2D) [SOP8-208], EN25QX64A(2D) [SOP8-150], EN25QX64A(2D) [USON8 4x4], EN25QX64A(2D) [WSON8 8x6], EN25QX64A(2D) [WSON8 6x5], EN25QX256A(2UC) [SOP8-208] (QuadSPI), EN25QX256A(2UC) [WSON8 8x6] (QuadSPI), EN25QX256A(2UC) [WSON8 6x5] (QuadSPI), EN25QX256A(2UC) [SOP8-208], EN25QX256A(2UC) [WSON8 8x6], EN25QX256A(2UC) [WSON8 6x5]
ESMT: EN25QX64A(2D) [SOP8-208] (QuadSPI), EN25QX64A(2D) [SOP8-150] (QuadSPI), EN25QX64A(2D) [USON8 4x4] (QuadSPI), EN25QX64A(2D) [WSON8 8x6] (QuadSPI), EN25QX64A(2D) [WSON8 6x5] (QuadSPI), EN25QX64A(2D) [SOP8-208], EN25QX64A(2D) [SOP8-150], EN25QX64A(2D) [USON8 4x4], EN25QX64A(2D) [WSON8 8x6], EN25QX64A(2D) [WSON8 6x5], EN25QX256A(2UC) [SOP8-208] (QuadSPI), EN25QX256A(2UC) [WSON8 8x6] (QuadSPI), EN25QX256A(2UC) [WSON8 6x5] (QuadSPI), EN25QX256A(2UC) [SOP8-208], EN25QX256A(2UC) [WSON8 8x6], EN25QX256A(2UC) [WSON8 6x5]
Espressif: ESP32-WROOM-32UE-x16Rx (incl.Encryption), ESP32-C6-WROOM-1U-x8
FORESEE: F35SQA512M [WSON8]
Fudan Microelect.: FM25LS02BI3 [TDFN8], FM25LS04BI3 [TDFN8]
Hitachi: DF3062BF
Infineon: CY8C4126AZI-S423, CY8C4126AXI-S423, CY8C4126AZI-S433, CY8C4126AZQ-S433, CY8C4126AXI-S433, CY8C4126AXQ-S433, S28HS02GTFPBxx05 [BGA24] (Octal I/O), XDPE15254D [QFN40] (Config)
Intersil: RAA228248
Macronix: MX25L12839F [SOP16] (Quad I/O)
Maxim: DS2406 [TO-92], DS2406 [TSOC6]
Microchip: AT89C55 [PQFP44], ATSAME70Q21A [UFBGA144], ATSAME70Q21B [UFBGA144], ATSAME70Q19A [UFBGA144], ATSAME70Q19B [UFBGA144], ATSAME70Q20B [UFBGA144], ATSAME70Q20A [UFBGA144], ATSAMS70Q19B [UFBGA144], ATSAMS70Q19A [UFBGA144], ATSAMS70Q20B [UFBGA144], ATSAMS70Q20A [UFBGA144], ATSAMS70Q21B [UFBGA144], ATSAMS70Q21A [UFBGA144], dsPIC33CK1024MP406, PIC16F17124, PIC16F17124 [SOIC14], PIC16F17125 [VQFN16], PIC16F17144, PIC16F17144 [SOIC20], PIC16F18013, PIC16F18023, PIC16F18425, PIC18F26Q24 [VQFN28], PIC18F26Q24 [SSOP28], PIC18F55Q24, PIC24FJ128GL306, PIC32MX174F256B, PIC32MX174F256D, PIC32MX274F256B, PIC32MZ1064DAL169, PIC32MZ1064DAL176
MicroPower: MP29F010ADP
MPS: MPM54322
NXP: MC9S08PB8 (ISP), MC9S08PB16 (ISP)
Pango: PGC10KD [MBG484](SVF)
Phison: PSE3A0SL-16GE [FBGA153], PSE3A0SL-08GE [FBGA153]
Puya Semiconductor: P25Q40TU [SOP8-150] (Quad I/O), P25Q40TU [TSSOP8] (Quad I/O), P25Q40TU [USON8 2x3] (Quad I/O), PY25Q16LB (Quad I/O), P25Q40TU [SOP8-150], P25Q40TU [TSSOP8], P25Q40TU [USON8 2x3], PY25Q16LB
Realtek: RTL8762EJO [QFN40]
Renesas: AT25EU0161A (Quad I/O), AT25QF128A (Quad I/O), AT25DF256 (Dual I/O), AT25DN256 (Dual I/O), AT25DF256, AT25DN256, AT25QF128A, AT25DF256 (ISP), AT25DN256 (ISP), DF3062BF, R5F10NMExFB, R5F10NMGxFB, R5F10NPGxFB, R7F100GJFxxFA, R7F701645xxFP, R7F701693xxFP, R7F701709xxFP, R7F701760xxFP, R7F701764xxFP, RAA228248
Silicon Laborat.: EFR32BG26B311F1024 [BGA136], EFR32BG26B311F2048 [BGA136], EFR32BG26B510F3200 [BGA136], EFR32BG26B511F3200 [BGA136], EFR32MG26B311F3200 [BGA136], EFR32MG26B510F3200 [BGA136], EFR32MG26B511F3200 [BGA136], EFM32PG26B101F512 [QFN68], EFM32PG26B101F512 [BGA136], EFM32PG26B301F1024 [QFN68], EFM32PG26B301F1024 [BGA136], EFM32PG26B301F2048 [QFN68], EFM32PG26B301F2048 [BGA136], EFM32PG26B500F3200 [QFN48], EFM32PG26B500F3200 [QFN68], EFM32PG26B500F3200 [BGA136], EFM32PG26B501F3200 [QFN48], EFM32PG26B501F3200 [QFN68], EFM32PG26B501F3200 [BGA136]
SS: SS25S02BNF [WSON8]
Telink Semicond.: TLSR8208H [QFN40] (Swire-fast)
TI (TMS): TPS546C20A, TPS546C23
Winbond: W25Q128JWxxM [SOIC16] (QuadSPI), W25Q16JWxxxM [SOIC8-150] (QUADSPI), W25Q16JWxxxM [SOIC8-150], W25Q16JWxxxM [USON8 2x3] (QuadSPI), W25Q16JWxxxM [USON8 2x3], W25Q32RVxxxQ [USON8 2x3], W25R512NWxxQ [SOIC16-300] (QuadSPI), W25R512NWxxQ [SOIC16-300](QuadSPI)(+RPMC), W25R512NWxxQ [WSON8 8x6](QuadSPI), W25R512NWxxQ [WSON8 8x6](QuadSPI)(+RPMC), W29N04LZBxBG [VFBGA63]
XMC: XM25RH128CXxQxxxS [WSON8 6x8] (QuadSPI), XM25RH128CHxQxxxS [SOP8-208] (QuadSPI), XM25RH128CXxQxxxS [WSON8 6x8], XM25RH128CHxQxxxS [SOP8-208], XM25RU128CXxQxxxS [WSON8 6x8] (QuadSPI), XM25RU128CHxQxxxS [SOP8-208] (QuadSPI), XM25RU128CXxQxxxS [WSON8 6x8], XM25RU128CHxQxxxS [SOP8-208]
XTX: XT25Q64F [SOP8-208] (QuadSPI), XT25Q64F [SOP8-208]
Other Changes
Added adapter: DIL48/ECLGA34 ZIF MPM-1
Added adapter: DIL48/LQFP80-1 ZIF-CS R5F-2
Added adapter: DIL48/QFN40-1.02 ZIF RTL-2
Added adapter: DIL48/QFN40-3.01 ZIF-CS TPS546-2
Added adapter: DIL48/QFN56-1.02 ZIF ISL-1
Added adapter: DIL48/QFP100-1.02a ZIF LPC-11
Added adapter: DIL48/QFP80-2.03 ZIF HD64-15
Added adapter: DIL48/TSSOP38-170 ZIF IMC-1
Added module: AP1 BGA400-2/2 ZIF PLD-1
Added module: AP1 QFN32 ZIF PLD-2
Added module: AP1 QFN40-1.02 ZIF RTL-2
Added module: AP1 QFP32-1.04 ZIF R7FA-1
Adesto Techn./Dialog Semicond. AT25SF161 (Quad O), changed device name and backward project compatibility
DIL48/module ZIF BGM-7, interface update
Discontinued module AP1 BGA400-2 ZIF PLD-1, replaced by AP1 BGA400-2/2 ZIF PLD-1
Espressif ESP32-WROOM-32UE-x16Rx (incl.Encryption), Encryption phase improved
Freescale Semic., NXP FS32K146HxxxxLHx [LQFP64], correction of memory map description
Giantec Semicond. GT25C512, verification procedure improved
Infineon XDPE15284D, programming procedure improvement
Macronix MX66L1G45GXD-10 [BGA24] (Quad I/O), alternative programming adapter DIL8/BGA24-2 ZIF SFlash-1b acceptance added
Macronix MX66L1G45Gxx-10 [SOP16] (Quad I/O), alternative programming adapter DIL16W/SOIC16 ZIF 300mil SFlash-1b acceptance added
Microchip dsPIC33FJ16GS504, JTAGEN bit default value changed
Microchip PIC24FJ64GA006, configuration bit setting modification
Microchip PIC32MZ2048EFM144 in 2wire JTAG mode, programming of configuration bits improved
Mitsubishi/Renesas M30620FCPGP, added ability to program Boot ROM and Block A separately
Nec/Renesas uPD78F050x [SSOP30], alternative programming adapter DIL30/SSOP30 ZIF 240mil acceptance added
Realtek RTS5450M [QFN46], power-up procedure improved
Renesas/Dialog Semiconductor DA14531MOD-00F01002, verify procedure improved
Renesas R7FA4M2AxxxFM, programming DLM state added
STMicroelectronics STM32U5xx, added WRP UNLOCK bits setting
Unknown mfr. SS25S01ANF [WSON8], manufacturer name assigned to SS (based on ONFI parameter page information)
Winbond W25Q256JVBxQ [TFBGA24] (QuadSPI), W25Q256JVCxQ [TFBGA24] (QuadSPI), device ID improved
Bug Fixes
Infineon/Cypress Semper S28HL256/512/01G S28HS256/512/01G, incorrect reading of Secured OTP memory fixed
Microchip dsPIC33FJ32MC202/204, PICmicro checksum calculation bug fixed
Micron MT35XU01GBBA1G12 [T-PBGA24] (Octa I/O), verification of Non Volatile Configuration Register bug fixed
Micron MT35XUxxx, verification of Non Volatile Configuration Register bug fixed
Samsung K9F1G08U0B [TSOP48], Program operation fixed
STMicroelectronics M24M01E-F, verification bug fixed
STMicroelectronics STM32L5xx, STM32U5xx, STM32H5xx, STM32H7xx, serialization file loading "Out of range address" bug fixed
Winbond W25Q128JWxxQ [SOIC16], internal error 1 [IEC:2, D:26] bug fixed
Xicor/IC Microsystems X24C00, reading/verification procedure bug fixed
Please Note
Changes, new device support and bug fixes are model specific and do not apply to all programmers.